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  87834-1811 Datasheet PDF File

For 87834-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0878341019

Molex Electronics Ltd.
Part No. 0878341019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 10 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-8118-11D
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878341219

Molex Electronics Ltd.
Part No. 0878341219
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 12 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 114.98K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-8118-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0878341221

Molex Electronics Ltd.
Part No. 0878341221
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.35K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131318-18111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 18 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    87834-1411 0878341411

Molex Electronics Ltd.
Part No. 87834-1411 0878341411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 14 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 68418-112HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    87834-6011 0878346011

Molex Electronics Ltd.
Part No. 87834-6011 0878346011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 60 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.33K  /  3 Page

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Amphenol Communications Solutions

Part No. 77315-118-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87834-6041 0878346041

Molex Electronics Ltd.
Part No. 87834-6041 0878346041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.73K  /  3 Page

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Amphenol Communications Solutions

Part No. 77315-418-11LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    87834-1421 0878341421

Molex Electronics Ltd.
Part No. 87834-1421 0878341421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-4218-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    87834-4011 0878344011

Molex Electronics Ltd.
Part No. 87834-4011 0878344011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-5618-11D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    87834-4013 0878344013

Molex Electronics Ltd.
Part No. 87834-4013 0878344013
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating

File Size 94.71K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-7418-11D
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, 8 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    87834-4019 0878344019

Molex Electronics Ltd.
Part No. 87834-4019 0878344019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3218-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

For 87834-1811 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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