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  87759-5076 Datasheet PDF File

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    87759-0874

Molex Electronics Ltd.
Part No. 87759-0874
Description 2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 50760-XX036LF
Description High Pin Count, Backplane Connectors, Header, Vertical, 4 Row, 0 Guide Pin, Solder-less Press-Fit, 80 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-0875

Molex Electronics Ltd.
Part No. 87759-0875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Texas Instruments

Part No. 5962-8775901MSA
Description Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs    

Official Product Page

    87759-1874

Molex Electronics Ltd.
Part No. 87759-1874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Texas Instruments

Part No. 5962-8775901M2A
Description Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Texas Instruments

Part No. 5962-8775901MRA
Description Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs    

Official Product Page

    87759-1664

Molex Electronics Ltd.
Part No. 87759-1664
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.97K  /  8 Page

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Amphenol Communications Solutions

Part No. 50003-5076FLF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 4 Row, 76 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87759-1665

Molex Electronics Ltd.
Part No. 87759-1665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 65076-001LF
Description PV® Wire-to-Board Connector System, Jumbo PV Housing..
Tech specs    

Official Product Page

    87759-1476

Molex Electronics Ltd.
Part No. 87759-1476
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.83K  /  6 Page

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Amphenol Communications Solutions

Part No. 65076-002LF
Description PV® Wire-to-Board Connector System, Jumbo PV Housing..
Tech specs    

Official Product Page

    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 421.28K  /  8 Page

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Amphenol Communications Solutions

Part No. 50295-5076ELF
Description High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 4 Row, 76 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87759-4276

Molex Electronics Ltd.
Part No. 87759-4276
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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    DAICO Industries
Part No. CTD05076
Description DAICO Bit/Threshold Detectors

File Size 39.64K  /  1 Page

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