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Molex Electronics Ltd.
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Part No. |
0015800207 15-80-0207 A-70567-0212
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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File Size |
1,218.31K /
7 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-E1-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
UPD78F0567FC-2N2-E1-A
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0015800685 70567-0168 A-70567-0168 15-80-0685
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective P MOLEX Connector
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File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0065 0015800065 70567-0137 A-70567-0137
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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File Size |
1,218.48K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
UPD78F0567FC-2N2-A
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0069 0015800069 A-70567-0273
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.56K /
7 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
UPD78F0567MC(S)-XXX-CAA-E1-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0085 0015800085 A-70567-0138
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
UPD78F0567MC-CAA-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0087 0015800087 A-70567-0206
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.48K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-E2-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
15-80-0089 0015800089 A-70567-0274
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.52K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
70567-0008 A-70567-0008 0015800201 15-80-0201
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
70567-0009 0015800221
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
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File Size |
1,218.41K /
7 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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