|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-0262 0757570262
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Texas Instruments |
Part No. |
MSP430F46161IPZR
|
Description |
16-Bit Ultra-Low-Power MCU, 92KB Flash, 4KB RAM, Comparator, DMA, 160 Seg LCD 100-LQFP -40 to 85
|
Tech specs |
|
|
Get Free Sample |
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-0261 0757570261
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 6 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Texas Instruments |
Part No. |
MSP430F46161IPZ
|
Description |
16-Bit Ultra-Low-Power MCU, 92KB Flash, 4KB RAM, Comparator, DMA, 160 Seg LCD 100-LQFP -40 to 85
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-0221 0757570221
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
98.95K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Renesas Electronics Corporation |
Part No. |
ISL6161CBZA
|
Description |
Dual Power Distribution Controller
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
ISL6161CBZA-T
|
Description |
Dual Power Distribution Controller
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
ISL6161IVZA-T
|
Description |
Dual Power Distribution Controller
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
ISL6161IBZA-T
|
Description |
Dual Power Distribution Controller
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-0252 0757570252
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Renesas Electronics Corporation |
Part No. |
ISL6161IBZA
|
Description |
Dual Power Distribution Controller
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-0242 0757570242
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
|
File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Amphenol Communications Solutions |
Part No. |
131-7616-11D
|
Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Molex Electronics Ltd.
|
Part No. |
75757-0231 0757570231
|
Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail, 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
|
File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
|
|
|
Amphenol Communications Solutions |
Part No. |
131-6616-11H
|
Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
77316-161LF
|
Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 11 Positions, 2.54mm (0.100in) Pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|