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Amphenol Communications Solutions |
| Part No. |
76341-342LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 42 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-422-30LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 30 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
http://
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| Part No. |
0757576181 75757-6181
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 16 Circuits, 2.5μm(100μ) Tin (Sn) Plating, 27.77mm (1.093) Mating Pin Length, 3.05mm (.120) PC Tail
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| File Size |
166.21K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
77313-422-08LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0231 0757570231
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail,
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-424-54LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 54 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-422-28LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 28 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0242 0757570242
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-427-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77313-427-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 04 Positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89891-342LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 84 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0322 0757570322
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
98.95K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-422KR06LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 06 Positions
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0252 0757570252
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77313-427-24LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 24 Positions
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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