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  2SC3182N-2014 Datasheet PDF File

For 2SC3182N-2014 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    SICK AG
Part No. 6020145
Description INDUCTIVE PROXIMITY SENSORS

File Size 1,107.76K  /  6 Page

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Amphenol Communications Solutions

Part No. 68020-140HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SICK AG
Part No. 6020146
Description INDUCTIVE PROXIMITY SENSORS

File Size 1,107.77K  /  6 Page

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Amphenol Communications Solutions

Part No. 74817-2014LF
Description Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Standard
Tech specs    

Official Product Page

    SICK AG
Part No. 6020147
Description INDUCTIVE PROXIMITY SENSORS

File Size 1,107.68K  /  6 Page

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Amphenol Communications Solutions

Part No. 90312-014LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 14 Position
Tech specs    

Official Product Page

    SICK AG
Part No. 6020149
Description INDUCTIVE PROXIMITY SENSORS

File Size 1,057.23K  /  6 Page

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Amphenol Communications Solutions

Part No. 10127720-141LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 14 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    GTL2014

NXP Semiconductors
Part No. GTL2014
Description 4-bit LVTTL to GTL transceiver

File Size 101.82K  /  15 Page

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Amphenol Communications Solutions

Part No. 10082201-406A04LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 4 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    ams AG
Part No. TSL2014
Description 896X1 LINEAR SENSOR ARRAY

File Size 602.52K  /  11 Page

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Amphenol Communications Solutions

Part No. 67292-014LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 28 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    T201401

E-SWITCH
Part No. T201401
Description ALL DIMENSIONS IN MM [INCH]

File Size 26.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 10147520-144-SHLF
Description Bergstak®FX10 0.5mm Board-to-Board, Vertical Header, for 4.3mm stack height, 144Positions, Dual Row
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. UBA2014
Description 600 V driver IC for HF fluorescent lamps

File Size 109.41K  /  20 Page

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Amphenol Communications Solutions

Part No. 54122-108201400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    DinTek Semiconductor Co,.Ltd
Part No. DTS2014
Description N-Channel 20 V (D-S) MOSFET Halogen-free

File Size 1,820.46K  /  9 Page

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Amphenol Communications Solutions

Part No. 10082201-404-06LF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Pin In Paste, Single row , 6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    HAF2014

Hitachi Semiconductor
Part No. HAF2014
Description Thermal MOS FETs

File Size 36.21K  /  6 Page

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Amphenol Communications Solutions

Part No. 98030-2014LF
Description Metral® High Speed 1000 Series, Backplane Connectors, Header, Vertical Signal, 8 Row, Press-Fit, 96 Position, Select Load, Extended.
Tech specs    

Official Product Page

For 2SC3182N-2014 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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