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  001580-1143 Datasheet PDF File

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    15-80-0581 0015800581

Molex Electronics Ltd.
Part No. 15-80-0581 0015800581
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Texas Instruments

Part No. UCC3921DTR/81143
Description Latchable Negative Floating Single, Hot-Swap IC Commercial Temp. 8-SOIC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800343

Molex Electronics Ltd.
Part No. 0015800343
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

File Size 1,218.29K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F1143AGB(S)-GAH-AX
Description 16-bit Low-power Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    0015800425

Molex Electronics Ltd.
Part No. 0015800425
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800721

Molex Electronics Ltd.
Part No. 0015800721
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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    0015800265

Molex Electronics Ltd.
Part No. 0015800265
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    15-80-0383 0015800383

Molex Electronics Ltd.
Part No. 15-80-0383 0015800383
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.08K  /  7 Page

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    15-80-0385 0015800385

Molex Electronics Ltd.
Part No. 15-80-0385 0015800385
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    15-80-0403 0015800403

Molex Electronics Ltd.
Part No. 15-80-0403 0015800403
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits

File Size 1,218.28K  /  7 Page

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    0015800725

Molex Electronics Ltd.
Part No. 0015800725
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.15K  /  7 Page

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    0015800623

Molex Electronics Ltd.
Part No. 0015800623
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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