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  001545-4616 Datasheet PDF File

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    0877584616 87758-4616

Molex Electronics Ltd.
Part No. 0877584616 87758-4616
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free

File Size 170.71K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4616-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0459846163

Molex Electronics Ltd.
Part No. 0459846163
Description 1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 6 Power Contacts

File Size 431.59K  /  7 Page

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Amphenol Communications Solutions

Part No. 77311-846-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0527461671 52746-1671

Molex Electronics Ltd.
Part No. 0527461671 52746-1671
Description 0.50mm (.020") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 16 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0.50mm (.020) Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 16 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging

File Size 529.77K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0702461604 70246-1604

Molex Electronics Ltd.
Part No. 0702461604 70246-1604
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC Tail Plating

File Size 176.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-146-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0702461602 70246-1602

Molex Electronics Ltd.
Part No. 0702461602 70246-1602
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.78K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4616-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    A-DATA[A-Data Technology]
Part No. VDS4616A4A-7 VDS4616A4A VDS4616A4A-5 VDS4616A4A-6
Description Synchronous DRAM(512K X 16 Bit X 2 Banks)

File Size 216.99K  /  8 Page

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Amphenol Communications Solutions

Part No. 77313-846-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs    

Official Product Page

    0702461601 70246-1601

Molex Electronics Ltd.
Part No. 0702461601 70246-1601
Description 2.54mm (.100") Pitch C-Grid庐 Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch C-Grid? Header, Low Profile, Dual Row, Vertical, Shrouded, 16Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 175.77K  /  4 Page

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Amphenol Communications Solutions

Part No. 10132446-16LF
Description Minitek® Pwr 3.0 HCC, Plug Housing, 16 Positions, Black Color, GW Compatible.
Tech specs    

Official Product Page

    0459846162 SD-45984-600

Molex Electronics Ltd.
Part No. 0459846162 SD-45984-600
Description 1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower Receptacle Header, Right Angle, 6 Power Contacts

File Size 431.60K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4616-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    5016461600 SD-501646-001 501646-1600

Molex Electronics Ltd.
Part No. 5016461600 SD-501646-001 501646-1600
Description 2.00mm (.079") Pitch iGrid Wire-to-Board Housing, Dual Row, Positive Lock, 16 Circuits
2.00mm (.079) Pitch iGrid Wire-to-Board Housing, Dual Row, Positive Lock, 16 Circuits

File Size 102.85K  /  2 Page

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Amphenol Communications Solutions

Part No. DWRT200PM14616
Description COOLPOWER MEZZANINE
Tech specs    

Official Product Page

    LTM4644-1 LTM8001 LTM4616

Linear Technology
Part No. LTM4644-1 LTM8001 LTM4616
Description Quad DC/DC μModule Regulator with Configurable 4A Output Array

File Size 1,043.80K  /  36 Page

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