SGW25N120 Fast IGBT in NPT-technology * 40% lower Eoff compared to previous generation * Short circuit withstand time - 10 s * Designed for: - Motor controls - Inverter - SMPS * NPT-Technology offers: - very tight parameter distribution - high ruggedness, temperature stable behaviour - parallel switching capability C G E P-TO-247-3-1 (TO-247AC) * Complete product spectrum and PSpice Models : http://www.infineon.com/igbt/ Type SGW25N120 Maximum Ratings Parameter Collector-emitter voltage DC collector current TC = 25C TC = 100C Pulsed collector current, tp limited by Tjmax Turn off safe operating area VCE 1200V, Tj 150C Gate-emitter voltage Avalanche energy, single pulse IC = 25A, VCC = 50V, RGE = 25, start at Tj = 25C Short circuit withstand time Power dissipation TC = 25C Operating junction and storage temperature Soldering temperature, 1.6mm (0.063 in.) from case for 10s Tj , Tstg -55...+150 260 C 1) VCE 1200V IC 25A Eoff 2.9mJ Tj 150C Package TO-247AC Ordering Code Q67040-S4277 Symbol VCE IC Value 1200 46 25 Unit V A ICpul s VGE EAS tSC Ptot 84 84 20 130 10 313 V mJ s W VGE = 15V, 100V VCC 1200V, Tj 150C 1) Allowed number of short circuits: <1000; time between short circuits: >1s. 1 Jul-02 Power Semiconductors SGW25N120 Thermal Resistance Parameter Characteristic IGBT thermal resistance, junction - case Thermal resistance, junction - ambient Electrical Characteristic, at Tj = 25 C, unless otherwise specified Parameter Static Characteristic Collector-emitter breakdown voltage Collector-emitter saturation voltage V ( B R ) C E S V G E = 0V , I C = 15 0 0 A VCE(sat) V G E = 15 V , I C = 25 A T j =2 5 C T j =1 5 0 C Gate-emitter threshold voltage Zero gate voltage collector current VGE(th) ICES I C = 10 0 0 A , VCE=VGE V C E =1200V,V G E =0V T j =2 5 C T j =1 5 0 C Gate-emitter leakage current Transconductance Dynamic Characteristic Input capacitance Output capacitance Reverse transfer capacitance Gate charge Internal emitter inductance measured 5mm (0.197 in.) from case Short circuit collector current 1) Symbol Conditions Max. Value Unit RthJC RthJA TO-247AC 0.4 40 K/W Symbol Conditions Value min. 1200 typ. max. - Unit V 2.5 3 3.1 3.7 4 3.6 4.3 5 A - 20 350 1400 100 2600 190 130 300 nC nH A nA S pF IGES gfs Ciss Coss Crss QGate LE IC(SC) V C E =0V,V G E =20V V C E = 20 V , I C = 25 A V C E = 25 V , V G E = 0V , f= 1 MH z V C C = 96 0 V, I C =2 5 A V G E = 15 V T O - 24 7A C V G E = 15 V ,t S C 10 s 10 0 V V C C 12 0 0 V, T j 15 0 C - 2150 160 110 225 13 240 1) Allowed number of short circuits: <1000; time between short circuits: >1s. 2 Jul-02 Power Semiconductors SGW25N120 Switching Characteristic, Inductive Load, at Tj=25 C Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy td(on) tr td(off) tf Eon Eoff Ets T j =2 5 C , V C C = 80 0 V, I C = 2 5 A, V G E = 15 V /0 V , R G = 22 , 1) L =1 8 0n H, 1) C = 4 0p F Energy losses include "tail" and diode reverse recovery. 45 40 730 30 2.2 1.5 3.7 60 52 950 39 2.9 2.0 4.9 mJ ns Symbol Conditions Value min. typ. max. Unit Switching Characteristic, Inductive Load, at Tj=150 C Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy td(on) tr td(off) tf Eon Eoff Ets T j =1 5 0 C V C C = 80 0 V, I C = 25 A , V G E = 15 V /0 V , R G = 22 , 1) L =1 8 0n H, 1) C = 4 0p F Energy losses include "tail" and diode reverse recovery. 50 36 820 42 3.8 2.9 6.7 60 43 990 50 4.6 3.8 8.4 mJ ns Symbol Conditions Value min. typ. max. Unit 1) Leakage inductance L and stray capacity C due to dynamic test circuit in figure E. Power Semiconductors 3 Jul-02 SGW25N120 100A Ic 100A tp=1s 15s IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT 80A 50s 10A 200s 1ms 1A 60A TC=80C 40A TC=110C 20A DC 0.1A Ic 0A 10Hz 100Hz 1kHz 10kHz 100kHz 1V 10V 100V 1000V f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency (Tj 150C, D = 0.5, VCE = 800V, VGE = +15V/0V, RG = 22) VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. Safe operating area (D = 0, TC = 25C, Tj 150C) 350W 300W 250W 200W 150W 100W 50W 0W 25C 60A 50A IC, COLLECTOR CURRENT 50C 75C 100C 125C Ptot, POWER DISSIPATION 40A 30A 20A 10A 0A 25C 50C 75C 100C 125C TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj 150C) TC, CASE TEMPERATURE Figure 4. Collector current as a function of case temperature (VGE 15V, Tj 150C) Power Semiconductors 4 Jul-02 SGW25N120 80A 70A 60A 80A 70A 60A IC, COLLECTOR CURRENT 50A 40A 30A 20A 10A 0A 0V 15V 13V 11V 9V 7V IC, COLLECTOR CURRENT V G E =17V V G E =17V 15V 13V 50A 40A 30A 20A 10A 0A 0V 11V 9V 7V 1V 2V 3V 4V 5V 6V 7V 1V 2V 3V 4V 5V 6V 7V VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristics (Tj = 25C) VCE, COLLECTOR-EMITTER VOLTAGE Figure 6. Typical output characteristics (Tj = 150C) 70A 60A VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE 80A 6V 5V IC=50A 4V IC=25A IC, COLLECTOR CURRENT 50A Tj=+150C 40A 30A 20A 10A 0A 3V Tj=+25C Tj=-40C 3V IC=12.5A 2V 1V 4V 5V 6V 7V 8V 9V 10V 11V 0V -50C 0C 50C 100C 150C VGE, GATE-EMITTER VOLTAGE Figure 7. Typical transfer characteristics (VCE = 20V) Tj, JUNCTION TEMPERATURE Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE = 15V) Power Semiconductors 5 Jul-02 SGW25N120 1000ns td(off) 1000ns td(off) t, SWITCHING TIMES tf 100ns t, SWITCHING TIMES 100ns td(on) tf tr td(on) tr 10ns 0A 20A 40A 60A 10ns 0 10 20 30 40 50 IC, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, RG = 2 2 , dynamic test circuit in Fig.E ) RG, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, IC = 25A, dynamic test circuit in Fig.E ) 6V VGE(th), GATE-EMITTER THRESHOLD VOLTAGE 1000ns td(off) 5V t, SWITCHING TIMES 4V max. 100ns td(on) tr tf 10ns -50C 3V typ. 2V min. 1V 0C 50C 100C 150C 0V -50C 0C 50C 100C 150C Tj, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE = 800V, VGE = +15V/0V, IC = 25A, RG = 2 2 , dynamic test circuit in Fig.E ) Tj, JUNCTION TEMPERATURE Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 0.3mA) Power Semiconductors 6 Jul-02 SGW25N120 25mJ *) Eon and Ets include losses due to diode recovery. 10mJ Ets* *) Eon and Ets include losses due to diode recovery. Ets* E, SWITCHING ENERGY LOSSES E, SWITCHING ENERGY LOSSES 20mJ 8mJ 15mJ Eon* 6mJ Eon* 4mJ Eoff 10mJ Eoff 5mJ 2mJ 0mJ 0mJ 0A 20A 40A 60A 0 10 20 30 40 50 IC, COLLECTOR CURRENT Figure 13. Typical switching energy losses as a function of collector current (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, RG = 2 2 , dynamic test circuit in Fig.E ) RG, GATE RESISTOR Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, IC = 25A, dynamic test circuit in Fig.E ) 8mJ *) Eon and Ets include losses due to diode recovery. 6mJ ZthJC, TRANSIENT THERMAL IMPEDANCE Ets* D=0.5 E, SWITCHING ENERGY LOSSES -1 10 K/W 0.2 0.1 0.05 R,(K/W) 0.07417 0.20899 0.08065 0.03681 R1 4mJ Eon* Eoff 2mJ 10 K/W 0.02 0.01 -2 , (s) 0.4990 0.08994 0.00330 0.00038 R2 0mJ -50C 0C 50C 100C 150C 10 K/W 1s -3 single pulseC 1 = 1 / R 1 C 2 = 2 /R 2 10s 100s 1ms 10ms 100ms 1s Tj, JUNCTION TEMPERATURE Figure 15. Typical switching energy losses as a function of junction temperature (inductive load, VCE = 800V, VGE = +15V/0V, IC = 25A, RG = 2 2 , dynamic test circuit in Fig.E ) tp, PULSE WIDTH Figure 16. IGBT transient thermal impedance as a function of pulse width (D = tp / T) Power Semiconductors 7 Jul-02 SGW25N120 20V Ciss VGE, GATE-EMITTER VOLTAGE 15V C, CAPACITANCE 1nF 10V UCE=960V 5V Coss 0V 0nC 100pF 0V Crss 10V 20V 30V 100nC 200nC 300nC QGE, GATE CHARGE Figure 17. Typical gate charge (IC = 25A) VCE, COLLECTOR-EMITTER VOLTAGE Figure 18. Typical capacitance as a function of collector-emitter voltage (VGE = 0V, f = 1MHz) 30s 500A tsc, SHORT CIRCUIT WITHSTAND TIME 25s IC(sc), SHORT CIRCUIT COLLECTOR CURRENT 400A 20s 300A 15s 200A 10s 5s 100A 0s 10V 11V 12V 13V 14V 15V 0A 10V 12V 14V 16V 18V 20V VGE, GATE-EMITTER VOLTAGE Figure 19. Short circuit withstand time as a function of gate-emitter voltage (VCE = 1200V, start at Tj = 25C) VGE, GATE-EMITTER VOLTAGE Figure 20. Typical short circuit collector current as a function of gate-emitter voltage (100VVCE 1200V, TC = 25C, Tj 150C) Power Semiconductors 8 Jul-02 SGW25N120 TO-247AC symbol dimensions [mm] min max 5.28 2.51 2.29 1.32 2.06 3.18 min [inch] max 0.2079 0.0988 0.0902 0.0520 0.0811 0.1252 A B C D E F G H K L M N P 4.78 2.29 1.78 1.09 1.73 2.67 0.1882 0.0902 0.0701 0.0429 0.0681 0.1051 0.76 max 20.80 15.65 5.21 19.81 3.560 21.16 16.15 5.72 20.68 4.930 0.0299 max 0.8189 0.6161 0.2051 0.7799 0.1402 0.8331 0.6358 0.2252 0.8142 0.1941 3.61 6.12 6.22 0.1421 0.2409 0.2449 Q Power Semiconductors 9 Jul-02 SGW25N120 i,v diF /dt tr r =tS +tF Qr r =QS +QF tr r IF tS QS tF 10% Ir r m t VR Ir r m QF dir r /dt 90% Ir r m Figure C. Definition of diodes switching characteristics 1 Tj (t) p(t) 2 r2 r1 n rn r1 r2 rn Figure A. Definition of switching times TC Figure D. Thermal equivalent circuit Figure B. Definition of switching losses Figure E. Dynamic test circuit Leakage inductance L =180nH, and stray capacity C =40pF. Power Semiconductors 10 Jul-02 SGW25N120 Published by Infineon Technologies AG i Gr., Bereich Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Power Semiconductors 11 Jul-02