CD54HC10, CD74HC10, CD54HCT10, CD74HCT10 Data sheet acquired from Harris Semiconductor SCHS128C August 1997 - Revised September 2003 High-Speed CMOS Logic Triple 3-Input NAND Gate Description The 'HC10 and 'HCT10 logic gates utilize silicon gate CMOS technology to achieve operating speeds similar to LSTTL gates with the low power consumption of standard CMOS integrated circuits. All devices have the ability to drive 10 LSTTL loads. The HCT logic family is functionally pin compatible with the standard LS logic family. [ /Title (CD74 HC10, CD74 HCT10 ) /Subject (High Speed CMOS Logic Triple 3-Input NAND Gate) /Autho r () /Keywords (High Speed CMOS Logic Triple 3-Input NAND Gate, High Speed CMOS Logic Triple 3-Input NAND Gate, Harris Semi- Features * Buffered Inputs * Typical Propagation Delay: 8ns at VCC = 5V, CL = 15pF, TA = 25oC * Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads * Wide Operating Temperature Range . . . -55oC to 125oC * Balanced Propagation Delay and Transition Times * Significant Power Reduction Compared to LSTTL Logic ICs * HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V * HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il 1A at VOL, VOH Ordering Information PART NUMBER CD54HC10F3A CD54HCT10F3A CD74HC10E CD74HC10M CD74HC10MT CD74HC10M96 CD74HCT10E CD74HCT10M CD74HCT10MT CD74HCT10M96 TEMP. RANGE (oC) -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 -55 to 125 PACKAGE 14 Ld CERDIP 14 Ld CERDIP 14 Ld PDIP 14 Ld SOIC 14 Ld SOIC 14 Ld SOIC 14 Ld PDIP 14 Ld SOIC 14 Ld SOIC 14 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC10, CD54HCT10 (CERDIP) CD74HC10, CD74HCT10 (PDIP, SOIC) TOP VIEW 1A 1 1B 2 2A 3 2B 4 2C 5 2Y 6 GND 7 14 VCC 13 1C 12 1Y 11 3C 10 3B 9 3A 8 3Y CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright (c) 2003, Texas Instruments Incorporated 1 CD54HC10, CD74HC10, CD54HCT10, CD74HCT10 Functional Diagram 1 1A 2 1B 2A 2B 2C 2Y GND 3 4 5 6 7 12 1Y 11 3C 10 3B 9 3A 8 3Y 13 1C 14 VCC TRUTH TABLE INPUTS nA L L L L H H H H nB L L H H L L H H nC L H L H L H L H OUTPUT nY H H H H H H H L H = High Voltage Level, L = Low Voltage Level Logic Symbol nA nB nY nC 2 CD54HC10, CD74HC10, CD54HCT10, CD74HCT10 Absolute Maximum Ratings DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .50mA Thermal Information Thermal Resistance (Typical, Note 1) JA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER HC TYPES High Level Input Voltage VIH 2 4.5 6 Low Level Input Voltage VIL 2 4.5 6 High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND VOL VIH or VIL VOH VIH or VIL -0.02 -0.02 -0.02 -4 -5.2 0.02 0.02 0.02 4 5.2 2 4.5 6 4.5 6 2 4.5 6 4.5 6 6 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 0.5 1.35 1.8 0.1 0.1 0.1 0.26 0.26 0.1 1.5 3.15 4.2 1.9 4.4 5.9 3.84 5.34 0.5 1.35 1.8 0.1 0.1 0.1 0.33 0.33 1 1.5 3.15 4.2 1.9 4.4 5.9 3.7 5.2 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 1 V V V V V V V V V V V V V V V V V V A SYMBOL VI (V) IO (mA) VCC (V) MIN 25oC TYP MAX -40oC TO 85oC MIN MAX -55oC TO 125oC MIN MAX UNITS 3 CD54HC10, CD74HC10, CD54HCT10, CD74HCT10 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Quiescent Device Current HCT TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. II VCC and GND VCC or GND VCC - 2.1 VOL VIH or VIL VIH VIL VOH VIH or VIL -0.02 4.5 to 5.5 4.5 to 5.5 4.5 2 4.4 0.8 2 4.4 0.8 2 4.4 0.8 V V V SYMBOL ICC VI (V) VCC or GND IO (mA) VCC (V) 0 6 MIN 25oC TYP MAX 2 -40oC TO 85oC MIN MAX 20 -55oC TO 125oC MIN MAX 40 UNITS A -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 0 5.5 - 0.1 - 1 - 1 A ICC ICC (Note 2) 0 - 5.5 4.5 to 5.5 - 100 2 360 - 20 450 - 40 490 A A HCT Input Loading Table INPUT All UNIT LOADS 0.6 NOTE: Unit Load is ICC limit specified in DC Electrical Specifications table, e.g. 360A max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER HC TYPES Propagation Delay, Input to Output (Figure 1) tPLH, tPHL CL = 50pF 2 4.5 6 Propagation Delay, Data Input to Output Y tPLH, tPHL CL = 15pF 5 8 100 20 17 125 25 21 150 30 26 ns ns ns ns SYMBOL TEST CONDITIONS VCC (V) 25oC MIN TYP MAX -40oC TO 85oC -55oC TO 125oC MIN MAX MIN MAX UNITS 4 CD54HC10, CD74HC10, CD54HCT10, CD74HCT10 Switching Specifications Input tr, tf = 6ns PARAMETER Transition Times (Figure 1) SYMBOL tTLH, tTHL (Continued) VCC (V) 2 4.5 6 Input Capacitance Power Dissipation Capacitance (Notes 3, 4) HCT TYPES Propagation Delay, Input to Output (Figure 2) Propagation Delay, Data Input to Output Y Transition Times (Figure 2) Input Capacitance Power Dissipation Capacitance (Notes 3, 4) NOTES: 3. CPD is used to determine the dynamic power consumption, per gate. 4. PD = VCC2 fi (CPD + CL) where fi = input frequency, CL = output load capacitance, VCC = supply voltage. tPLH, tPHL tPLH, tPHL tTLH, tTHL CI CPD CL = 50pF CL = 15pF CL = 50pF 4.5 5 4.5 5 9 28 24 15 10 30 19 10 36 22 10 ns ns ns pF pF CI CPD 5 25oC MIN TYP 24 MAX 75 15 13 10 -40oC TO 85oC -55oC TO 125oC MIN MAX 95 19 16 10 MIN MAX 110 22 19 10 UNITS ns ns ns pF pF TEST CONDITIONS CL = 50pF Test Circuits and Waveforms tr = 6ns INPUT 90% 50% 10% tf = 6ns VCC tr = 6ns INPUT GND 2.7V 1.3V 0.3V tf = 6ns 3V GND tTLH 90% tTHL tTLH 90% 50% 10% tPHL tPLH tTHL INVERTING OUTPUT INVERTING OUTPUT tPHL tPLH 1.3V 10% FIGURE 5. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC FIGURE 6. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5 PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 PACKAGING INFORMATION Orderable Device 5962-8984301CA CD54HC10F CD54HC10F3A CD54HCT10F3A CD74HC10E CD74HC10M CD74HC10M96 CD74HC10MT CD74HCT10E CD74HCT10M CD74HCT10M96 CD74HCT10MT (1) Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE Package Type CDIP CDIP CDIP CDIP PDIP SOIC SOIC SOIC PDIP SOIC SOIC SOIC Package Drawing J J J J N D D D N D D D Pins Package Eco Plan (2) Qty 14 14 14 14 14 14 14 14 14 14 14 14 1 1 1 1 25 50 2500 250 25 50 2500 250 None None None None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Lead/Ball Finish Call TI Call TI Call TI Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-NC-NC-NC Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. 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